CRI>98 5600K/3200K High Power 100W 200W RGBWW LED COB Chip For
Studio Video Light/ Film Shooting
Applications
Studio Video Light/ Film Shooting/ Photography Lighting
Product Parameters
Product Information |
Item | 200W SMD LED |
Size | 40*46/35 |
Current | 1400mA |
Voltage | 24-28 V |
Wavelength | RED+BLUE+GREEN+WARM WHITE/ COOL WHITE |
Chip Brand | Epileds |
Application | Film Shooting/ Photography Lighting
|
Warranty Spanlife
| 3 Years 50000 hours |
Features
◆ Mechanical Dimensions 46.0x40.0x2.7(mm)
◆ Package Structure : Aluminium Base Chip on Board
◆ CRI(Ra): Min.80
◆ Nominal CCT :3,100K,5,600K
◆ Chromaticity Range : 3-step MacAdam Ellipse
◆ RoHS compliant
◆ Better die arrangement for optics . Wide range of luminous
fluxand high efficacy
Electro Optical Characteristics
Product Code |
Nominal CCT | CRI(Ra) | Luminous Flux(lm) | Efficacy ( lm/W ) |
Forward Current (mA) | Voltage (V) |
| Ra | R9 |
| Min. | Min. | Min. | Typ. | Typ. | Min. | Typ. | Max. |
XCT4635-H082 0-A3156/95-A 33 | 3100K | 97 | 90 | 3262 | 3412 | 92 | 1400 | 24 | 25.1 | 28 |
| 5600K | 97 | 90 | 2640 | 2793 | 75 | 1400 | 24 | 25.2 | 28 |
Product Code |
Nominal CCT | CRI(Ra) | Luminous Flux |
W.D | Forward Current (mA) | Voltage (V) |
| Ra | R9 |
| Min. | Min. | Min. | Typ. | Min. | Max. | | Min. | Typ. | Max. |
| R | / | / | / | 2065 | 2160 | 620 | 625 | 1400 | 20 | 22 | 24 |
| G | / | / | / | 2052 | 2147 | 520 | 525 | 1400 | 24 | 27 | 28 |
| B | / | / | / | 617 | 655 | 455 | 460 | 1400 | 24 | 25.4 | 28 |
Absolute Maximum Ratings
| Parameter | Symbol | Rating |
| Forward Current | IF | 1800mA |
| Reverse Current | IR | 1mA |
| Operating Temperature | TOPR | -30℃ To +75℃ |
| Storage Temperature | Tst | -30℃ To +75℃ |
| Case Temperature | Tc | 85℃ |
| Junction Temperature | TJ | 125℃ |
| Soldering Temperature | TSOL | 350℃± 10℃ For 5 Seconds |
| ESD Sensitivity | ESD | 2000V HBM |
Mechanical Dimensions
Application
Precautions for use :
Soldering
SMD LED encapsulation gumwater is flexible, and external force
easily damages radiant surface and plastic shell.So when soldering
, Please handle with care!
A. Reflow soldering shall be not more than two times and is
suggested to be taken under reflow curve conditions with No-clean Flux, .The radiant surface shall be clean
and unclean surface may influence the emitting color.
B. Manual soldering is only used for reparing. Anti-static iron
(25W) is recommended and tweezer or iron should not touch the radiant surface and plastic parts. The
soldering time should be not more than 3 seconds.
C. Don’t twist LED in course of manual soldering and testing, which
may cause LED failure.
D. Please select the LED devices in the same BIN on the same PCB,
otherwise may cause chromatic aberration.
Cleaning
A . Ultrasonic cleaning is not allowed. We recommend isopropyl
alcohol or pure alcohol to for cleaning or dipping within 1 minute
and reuse after 15 minutes in room temperature. LThe radiant
surface shall be clean after cleaning and other wisemayh influence
radiant color.
B. Isoamyl acetate, trichloroethylene, acetone, sulfide, nitride,
acid, alkali and salt shall be avoided from LED, which may cause
damage to LED.
Encapsulation
A . Encapsulation glue containing sodium ion or sulfide shall be
avoided, which may cause fading fluorescence powder (poisoning).
B . When using normal encapsulation glue, trial testing is
recommended for 168-hour operation before mass production.
Storage
A. The LED should be stored at 30℃ or less and 60%RH or less before
opening the package. The storage shall not be over half a year.
B. After opening the package, the LEDs should be kept at 30-35%RH
or less, and should be used within 3 days.
C. When temperature card shows 20% above after package opened,
baking treatment shall be conducted before use(for reel package,:
baking at 60±3℃ for 12 hrs; for bulk goods, baking at 120±5℃ for 4
hrs)
D. Acid, alkali and corrosive gas should be avoided in storage
environment and intensively shock and high magnetic field also
avoided.
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